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Hazardous Chemicals

     

 

   

Hazardous chemicals or materials (HAZMAT) are routinely used in various aspects of the semiconductor industry. It is imperative for every employee who handles these dangerous materials to observe safety measures at all times. 

       

 

Being able to stay safe from these chemicals can only be achieved if the employee is aware of the following: 1) what hazardous chemicals are in his working environment; 2) the characteristics of these chemicals; 3) how these chemicals should be handled; and 4) how injury from them should be treated.  Some of the more commonly used hazardous chemicals in the industry are presented in the following tables.

                

Table 1. Corrosive Materials - Acids and Bases      

Corrosive Materials: Acids and Bases (Caustics)

Characteristics

- generally non-flammable

- can burn tissues

Protection Required

- total cover for skin and eyes where exposure is possible using the appropriate acid-/base-protective gear

Hazardous Effects

- severe burns to skin and eyes

- severe burns to the lungs if the fumes are inhaled

First Aid Treatment

- continuously flush with large amounts of running water

Examples

 

1) Hydrochloric Acid (HCl) - used in various etches

2) Sulfuric Acid (H2SO4) - used in stripping plastic and organic materials such as plastic package decapsulation

3)  Nitric Acid (HNO3) - used in various etches and, at a higher concentration, for plastic package decapsulation

4) Aqua Regia (3HCl:1HNO3) - rapid etch for Au, Pt, PtSi; highly corrosive

5) Hydroflouric Acid (HF) - highly dangerous with its ability to cause severe burns with no sensation of pain for 4 to 12 hours; used in etching silicon dioxide

6) Phosphoric Acid (H2PO4) - used in removing aluminum and silicon nitride

7)  Sodium hydroxide (NaOH) - a strong base usually in the form of hydroscopic pellets that are dissolved in water for use in various etches

8)  Potassium hydroxide (KOH) - same as NaOH

9) Ammonium hydroxide (NH4OH) - a weak base used in various etches

      

        

<Proceed to Page 2 - Water-Reactive Chemicals and Organic Solvents>

<Proceed to Page 3 - Oxidizers, Toxic Gases, Bulk Nitrogen>

 

 

      

See Also:  Wafer Fab Chemical Reactions;  Semiconductor Materials

    

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