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Package-related Failure Mechanisms and Attributes
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Ball
Lifting
Ball lifting, is the detachment of a ball bond from the bond pad of a semiconductor device. See separate article on ball lifting.
Bond Shorting
Bond Shorting is the presence of an unintended electrical connection between two bonds.
Contamination, External
External
contamination is the presence of a foreign material, whether attached or
unattached,
See separate article on external package contamination.
Contamination, Internal
Internal contamination is the presence of a foreign material, whether attached or unattached, anywhere inside the package of the device. See separate article on internal package contamination.
Cratering
Die Chip-outs
Die chipping
Die
Corrosion
Die corrosion refers to the corrosion of the metal areas on the surface of the die.
Die Cracking
Die cracking is the occurrence of fracture(s) in or on any part of the die.
Die Lifting
Die lifting is the disbonding or detachment of the die from its die pad or die cavity.
Die
Scratches
See Also: Die Failures; Failure Analysis; Basic FA Flows; Reliability Models
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Cratering
is a partial or total fracture of the silicon material underneath the
bond pad. Cratering is commonly due to excessive stresses on the bond
pads from a poorly set up wirebonding machine. Bonding time, force and
power are critical parameters when dealing with cratering.